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Home/Products/Depth Filters/Semi-grade PP Depth Filter

Depth Filters

Semi-grade PP Depth Filter

Product ID: semi-grade-pp-depth-filter|Semi-grade PP

High-end PP depth filter designed specifically for semiconductor chemical mechanical polishing (CMP) processes. Using a unique 3D gradient structure and nanofiber technology, it can accurately intercept large agglomerated particles (Agglomerates) that cause scratches, while allowing effective abrasive particles to pass through, maintaining the Slurry particle size distribution unchanged. Providing 70nm to 1.0µm accuracy, it is the best solution to optimize CMP yield and reduce costs.

Unique 3D gradient structure with nano-fiber technology
Precisely captures scratch-causing agglomerates
Passes active abrasive particles, keeping slurry PSD unchanged
Filtration ratings from 70nm to 1.0µm
Engineered to optimize CMP yield and reduce cost

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Micron rating: 50 nm – 150 µm
Max operating temperature: 80 °C (176 °F)
Nominal lengths: 10" / 20"
Nominal outer diameter: Ø64 mm / Ø70 mm

Applications

Semiconductor CMP process

CMP slurry filtration

Scratch-causing agglomerate removal

Maintaining slurry particle size distribution

Specifications

Filter media / membrane: Patented 3-D composite graded polypropylene depth media. The outer (upstream) section is continuous melt-blown microfibre, the inner (downstream) section is wound nanofibre, with pore size converging continuously between them to form a large-gradient staged structure.
Support & drainage layers: Polypropylene support layer; no surfactants and no binders anywhere in the process, to avoid organic extractables
Cage, core & end caps: Polypropylene core and end caps — all-polypropylene, metal-free
Seals / O-rings: EPDM O-ring
Micron rating: 50 nm / 70 nm / 0.1 µm / 0.2 µm / 0.3 µm / 0.5 µm / 0.7 µm / 1 µm / 3 µm / 5 µm / 10 µm / 25 µm / 40 µm / 150 µm
Removal efficiency: The ultra-fine inner fibre layer gives high retention of defect-causing particles while allowing the desired abrasive through; the large gradient optimises efficiency and service life together rather than trading one for the other.
Nominal outer diameter: Ø64 mm / Ø70 mm
Nominal lengths: 10" / 20"
End cap / connection: 222 flat (code N); double open end with gasket (code F)
Max operating temperature: 80 °C (176 °F)
Max forward differential pressure: 0.52 MPa (75 psi) @ 25 °C; 0.19 MPa (27 psi) @ 82 °C
Max reverse differential pressure: 0.21 MPa (30 psi) @ 25 °C
Wetting & flushing: The polypropylene media is hydrophobic — flush and vent with process liquid or UPW before start-up; UPW pre-wet packing can be specified for direct installation.
Extractables & cleanliness: Electronic-grade cleanliness (code E) selectable: produced and packed in a cleanroom and rinsed with UPW until resistivity recovers.
Packaging: Dry packed; UPW pre-wet packed
Regulatory & validation: Manufactured, tested and packaged in a cleanroom

Note: actual compatibility and service life depend on chemical concentration, temperature, flow, differential pressure, upstream contamination load and housing design. Validate under your real process conditions.

Part Number BuilderJY-CM31

Example part number

-CM31

JY: JIUNYUAN Technology
CM31: Melt-blown or rolled PP depth media
70: Ø70 mm
R70: 70 nm
20: 20"
T2E: 222 flat | EPDM O-ring

Selectable options by segment

Media construction (appended to series code)

Code	Specification
D	Melt-blown depth (highest dirt-holding)
R	Rolled (highest retention efficiency)

e.g. JY-CM31R-70-R70-20-T2E is the rolled option. Trial both constructions in parallel and compare scratch counts and lifetime.

Outer diameter

Code	Specification
64	Ø64 mm
70	Ø70 mm

Retention rating

Code	Specification
R50	50 nm
R70	70 nm
P10	0.1 µm
P20	0.2 µm
P30	0.3 µm
P50	0.5 µm
M001	1 µm
M003	3 µm
M005	5 µm
M010	10 µm
M025	25 µm
M040	40 µm
M150	150 µm

Length

Code	Specification
10	10"
20	20"

End cap

Code	Specification
T2	222 / flat
T6	226 / flat
F2	222 / fin
DO	Double open end (DOE)

O-ring material

Code	Specification
V	TEV (modified EPDM)
E	EPDM

Not every combination is a stock item; uncommon combinations are made to order. Confirm with JIUNYUAN sales before ordering.

Dimensions

Double open end (DOE)Drawing shows one representative size; the table below gives the exact diameter and length of each code.

End cap / nominal length	Ø (nominal OD)	A (overall length)
222 平頭（N）　10"	Ø69 mm	264 ± 1 mm
222 平頭（N）　20"	Ø69 mm	512 ± 1 mm
雙開口平墊（F）　10"	Ø69 mm	254 ± 2 mm
雙開口平墊（F）　20"	Ø69 mm	508 ± 2 mm

A = overall length. B (seal face to seal face) and C (effective media length) in the drawing vary with end-cap style; drawings available on request.

Flow vs. Differential Pressure

UPW at 25 °C, single 10" cartridge, clean initial ΔP　Right axis shows the same values in psi.

The 0.2 µm curve falls between 0.1 µm and 0.3 µm and is omitted from the plot for legibility.

View data table

LPM / GPM	70 nm	0.1 µm	0.3 µm	0.5 µm	0.7 µm	1.0 µm
5.00 / 1.32	21.4	18.9	15.3	12.7	10.8	9.15
10.0 / 2.64	42.8	37.8	30.5	25.4	21.6	18.3
15.0 / 3.96	64.2	56.7	45.8	38.1	32.4	27.5
20.0 / 5.28	85.6	75.6	61.0	50.8	43.2	36.6

Details

Where it fits

Process position.The workhorse for CMP slurry filtration. The continuously graded structure captures the large, defect-causing particles without altering the mean particle size and distribution set by the slurry manufacturer. It can sit upstream of point-of-use filters to extend their life, or serve as the final barrier before slurry distribution.

Continuously graded structure

Key characteristics

Key features.Media density increases continuously from outside in, so large particles are captured in the outer layers and fine particles only in the inner. Contaminant is distributed through the full media thickness rather than piling on the surface, giving far higher dirt-holding than surface filtration at the same rating.

Two constructions

Melt-blown depth (code D) gives the highest dirt-holding; rolled (code R) gives the highest retention efficiency and lower pressure drop. Trial both and decide on measured scratch counts and change-out intervals.

The widest retention range

Full coverage from 50nm to 150µm puts everything from the finest point-of-use duty to the coarsest upstream interception on one material platform, simplifying inventory and qualification.

Slurry compatibility

All-PP construction is compatible with most slurries including STI, tungsten and copper. Flushed with ultrapure water before shipment for low particle shedding.

✓

If ΔP is climbing too fast or life is falling short, consider JY-CM32 (re-engineered fiber gradation, higher dirt-holding) or JY-CM61 (dual-layer pleated/rolled, giving area and retention together).

FAQ

What process is this depth filter for?

It is designed for semiconductor chemical mechanical planarization (CMP), filtering CMP slurry to capture the large agglomerates that cause wafer scratches while letting active abrasive particles pass through.

Does it change the slurry PSD?

No. Its 3D gradient structure and nano-fiber technology capture only large agglomerates while allowing active abrasives through, keeping the slurry particle size distribution unchanged.

What filtration ratings are available?

Ratings range from 70nm to 1.0µm, so you can match the grade to your CMP slurry characteristics and yield requirements.

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Semi-grade PP Depth Filter

Media construction (appended to series code)

Outer diameter

Retention rating

Length

End cap

O-ring material

Where it fits

Continuously graded structure

Key characteristics

Two constructions

The widest retention range

Slurry compatibility

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Further Reading

Liquid Filter Rating Selection: Matching Process Needs

Estimating Liquid Filter Lifespan: Drivers and Replacement Triggers

Multi-Stage Filtration Design Logic for Semiconductor UPW Systems