Where it fits
This cartridge serves the chemical point of use in wet etch and clean: SC1, SC2, 49% hydrofluoric acid, nitric acid, photoresist strippers and NMP. Elements here are soaked in aggressive, oxidising chemistry continuously, so the first selection hurdle is not retention but whether the whole cartridge survives the chemistry at all.
Key characteristics
The build is all-fluoropolymer: a PTFE membrane with PFA support and drainage layers, cage, core and end caps, with no adhesives and no metal parts. The reasoning is simple — the hardware matches the membrane in chemical resistance, so it is never the element that limits which chemistries you can run, and there is no adhesive to become an extractables source.
O-rings are selected to suit the chemistry, in modified EPDM or perfluoroelastomer, with perfluoroelastomer recommended for strongly oxidising and hot chemistries. Metal cleanliness is selectable at < 3 / < 10 / < 25 µg/device with an electronic grade also available, and every cartridge is 100% integrity tested.
Choosing between options
With the same PTFE membrane, the hardware decides temperature range and unit cost:
| Hardware | Max temp | Rating range | Choose it when |
|---|---|---|---|
| PFA all-fluoropolymer (this) | Cartridge 100 °C / disposable 180 °C | 10 nm – 0.2 µm | Strong acids and bases, hot chemistry, hardware must not be the weak link |
| PP | 70 °C | 20 nm – 1 µm | Ambient wet processing where cost also matters |
| HDPE | 40 °C | 20 nm – 1 µm | Low temperature, most cost-sensitive stages |
Operation & change-out
Ultrapure-water pre-wet delivery is available. Maximum forward ΔP is 0.5 MPa at 25 °C, falling to 0.2 MPa at 100 °C, with 0.35 MPa reverse.